dish wireless l l c H1B Salary & PERM Data
Last updated from DOL OFLC Disclosure Data · FY2025
The median H1B base salary at dish wireless l l c is $118,337, based on 57 disclosure filings to the U.S. Department of Labor through FY2025.
Source: DOL OFLC Disclosure Data (FY2025) · Methodology
Median H1B Wage
$118,337
Total H1B Filings
57
Wage Range
$74,767 – $199,961
Prevailing Wage Premium
16.6% above
Top H1B Job Titles
| # | Job Title | Filings |
|---|---|---|
| 1 | ENGINEER II-WIRELESS | 9 |
| 2 | RF Engineer II | 6 |
| 3 | SENIOR ENGINEER-WIRELESS | 5 |
| 4 | Senior Engineer - Wireless | 3 |
| 5 | Staff Engineer - Software | 3 |
PERM Labor Certification
PERM Filings
18
Median Processing Time
487 days
Summary
As of FY2025, dish wireless l l c has filed 57 H-1B LCA applications with a median annual wage of $118,337, representing a 16.6% premium above the DOL prevailing wage for the matching SOC occupation codes. The top job titles were ENGINEER II-WIRELESS, RF Engineer II and SENIOR ENGINEER-WIRELESS. dish wireless l l c's PERM filings numbered 18, with a median processing time of 487 days. Source: U.S. Department of Labor OFLC Disclosure Data, aggregated and analyzed by VisaSalaries Research. Methodology: https://visasalaries.com/methodology
Frequently Asked Questions
What is the median H1B salary at dish wireless l l c?
The median H1B base salary at dish wireless l l c is $118,337, based on 57 labor condition application (LCA) filings disclosed by the U.S. Department of Labor through FY2025.
How many H1B applications has dish wireless l l c filed?
dish wireless l l c has 57 H1B LCA filings on record with the U.S. Department of Labor through FY2025.
What is the H1B salary range at dish wireless l l c?
Disclosed H1B annual wages at dish wireless l l c range from $74,767 to $199,961, based on DOL OFLC filings through FY2025.
How do dish wireless l l c H1B wages compare to the prevailing wage?
The median H1B wage at dish wireless l l c is 16.6% above the U.S. Department of Labor prevailing wage for the matching SOC occupations.
What are the most common H1B job titles at dish wireless l l c?
The most-filed H1B job titles at dish wireless l l c are ENGINEER II-WIRELESS, RF Engineer II, SENIOR ENGINEER-WIRELESS, Senior Engineer - Wireless and Staff Engineer - Software. Source: DOL OFLC Disclosure Data.
Where does this dish wireless l l c H1B data come from?
All figures are aggregated from U.S. Department of Labor OFLC disclosure filings (H-1B LCA records) by VisaSalaries and updated quarterly. See our methodology at https://visasalaries.com/methodology for details.
How many PERM applications has dish wireless l l c filed?
dish wireless l l c has 18 PERM labor certification filings on record with the U.S. Department of Labor.
How long does dish wireless l l c's PERM take to process?
The median PERM processing time at dish wireless l l c is 487 days, based on DOL OFLC PERM disclosure data.