semiconductor components industries H1B Salary & PERM Data
Last updated from DOL OFLC Disclosure Data · FY2026
The median H1B base salary at semiconductor components industries is $119,938, based on 442 disclosure filings to the U.S. Department of Labor through FY2026.
Source: DOL OFLC Disclosure Data (FY2026) · Methodology
Median H1B Wage
$119,938
Total H1B Filings
442
Wage Range
$70,462 – $270,000
Prevailing Wage Premium
13.8% above
Top H1B Job Titles
| # | Job Title | Filings |
|---|---|---|
| 1 | Product Engineer | 17 |
| 2 | Applications Engineer | 13 |
| 3 | Industrial Engineer | 9 |
| 4 | Materials Planner | 9 |
| 5 | Principal Systems Analyst | 9 |
PERM Labor Certification
PERM Filings
96
Median Processing Time
224 days
Summary
As of FY2026, semiconductor components industries has filed 442 H-1B LCA applications with a median annual wage of $119,938, representing a 13.8% premium above the DOL prevailing wage for the matching SOC occupation codes. The top job titles were Product Engineer, Applications Engineer and Industrial Engineer. semiconductor components industries's PERM filings numbered 96, with a median processing time of 224 days. Source: U.S. Department of Labor OFLC Disclosure Data, aggregated and analyzed by VisaSalaries Research. Methodology: https://visasalaries.com/methodology
Frequently Asked Questions
What is the median H1B salary at semiconductor components industries?
The median H1B base salary at semiconductor components industries is $119,938, based on 442 labor condition application (LCA) filings disclosed by the U.S. Department of Labor through FY2026.
How many H1B applications has semiconductor components industries filed?
semiconductor components industries has 442 H1B LCA filings on record with the U.S. Department of Labor through FY2026.
What is the H1B salary range at semiconductor components industries?
Disclosed H1B annual wages at semiconductor components industries range from $70,462 to $270,000, based on DOL OFLC filings through FY2026.
How do semiconductor components industries H1B wages compare to the prevailing wage?
The median H1B wage at semiconductor components industries is 13.8% above the U.S. Department of Labor prevailing wage for the matching SOC occupations.
What are the most common H1B job titles at semiconductor components industries?
The most-filed H1B job titles at semiconductor components industries are Product Engineer, Applications Engineer, Industrial Engineer, Materials Planner and Principal Systems Analyst. Source: DOL OFLC Disclosure Data.
Where does this semiconductor components industries H1B data come from?
All figures are aggregated from U.S. Department of Labor OFLC disclosure filings (H-1B LCA records) by VisaSalaries and updated quarterly. See our methodology at https://visasalaries.com/methodology for details.
How many PERM applications has semiconductor components industries filed?
semiconductor components industries has 96 PERM labor certification filings on record with the U.S. Department of Labor.
How long does semiconductor components industries's PERM take to process?
The median PERM processing time at semiconductor components industries is 224 days, based on DOL OFLC PERM disclosure data.